最完整的EFA分析技术
确认失效位置的电性分析工具
Electrical Failure Analysis Tools for Fault Isolation
  • PKG
    Wafer
  • Speed /
    Frequency
  • LVP /
    LVI
  • Dynamic
    testing
  • DIE
  • DIE
  • PKG
  • MOS e-h+ pair
    recombination
    hot carrier
  • Resistance
    variation
  • Thermal
    radiation
  • EMMI InGaAs
    ( IR-detector )
    SI
  • OBIRCH
  • THEMOS
  • Dynamic & Static testing
  • DC-static
    testing
  • DC-static
    testing
  • DIE
    Wafer
  • DIE
    Wafer
  • Junction Leakage
    Gox breakdown
  • Interconnect
    defects
  • EBIC
  • EBAC
  • 1-2
    probes
  • 1-2
    probes
Die Lapping down to
via / contact level
  • Contact/
    via
  • Contact/
    via
  • Contact/
    via
  • MOS
    I-V
  • AVC
  • PVC
  • C-AFM
  • Nano-
    probe
  • DC
    bias
  • NO
    bias
  • 1
    probe
  • 8
    probes